TSMC abandoned the traditional method in chip technology!

TSMC plans to abandon traditional round wafers and move to innovative rectangular assemblies (substrates) in a new approach that will revolutionize chip manufacturing. These new assemblies will allow more chips to be placed in each unit, increasing production exponentially. So what benefits will this have? Here are the details…

TSMC will use rectangular layouts for future AI technologies in chip technology

The rectangular assemblies that TSMC is working on measure 510 mm x 515 mm and have a usable area three times larger than standard round wafers. This shape minimizes gaps at the edges, optimizing space and reducing waste. Although this technology is still in the experimental stage, it may be several years before it becomes commercially available.

Increasing interest in artificial intelligence (AI) technologies requires chip manufacturers such as TSMC to keep up with the demand for computing power. Chip packaging plays a critical role in the advancement of semiconductor technology. TSMC’s CoWoS (chip-on-wafer-on-substrate) technology, like Nvidia’s H200 and B200 AI processing chips, will feature advanced packaging methods, increasing data processing speed and computational performance.

The transition to rectangular assemblies will present significant challenges for TSMC and its suppliers. Investment of time and resources will be required to develop and adapt production processes. Additionally, understanding how to apply photoresist on new devices will be a significant challenge. So what does this technology do for us?

This new technology will lead to less material waste in the production process and significantly reduce overall production costs. This decrease in production costs will be reflected in more affordable products to the consumer. Rectangular layouts allow more chips to be placed in the same space, which means higher processing power and performance. This gives consumers faster And more efficient smartphones, computers and other electronic devices will present.

TSMC’s main rival Samsung also for chip production glass assemblies It carries out intensive R&D studies on Glass substrates offer higher planarity than organic assemblies, increasing the sensitivity of lithography processes. Samsung plans to launch this technology in 2026.

The development of these new technologies promises significant advances in the semiconductor industry. What are you thinking? You can write your opinions in the comments section below.