Dutch ASML, is clearly the most important technology company in today’s world. The company provides the production of the most advanced chips. extreme ultraviolet It is the only supplier of (EUV) lithography systems in the world. And now ASML has announced its roadmap for the future. The company’s future Hyper-NA He announced that he would build on his lithograph. Here are the details about ASML Hyper-NA:
former president of ASML Martin van den BrinkIn a recent presentation, the company’s newly introduced High-NA will replace EUV systems announced that it is working on a new “Hyper-NA” EUV technology. Although the process for Hyper-NA is currently in its early stages, this the first at Intel’s US facility It will be the lithography technology that will follow the High-NA systems, which cost $400 million each.
High-NA As is known with numerical aperture (NA) in previous EUV vehicles 0,33’ten 0,55 to the level had been removed. this too 2 nanometers (nm) or less It allows drawing patterns necessary for the development of process nodes. Almost three years ago, ASML said High-NA would help chipmakers reach process nodes well beyond 2nm for at least 10 years. Now ASML, Hyper-NA reaching 0.75 NA around 2030 is preparing to present its lithography machines. This is of course based on Martin van den Brink’s presentation. ASML said in its statement that work on Hyper-NA is continuing, although it did not give a date.
An increase in numerical aperture from 0.55 to 0.75 will enable chips with transistor densities beyond their predicted limits. With increasing numerical aperture, complex and costly Dependence on multiple patterning techniques will also decrease. However, there are some obstacles to overcome for Hyper-NA. When the numerical aperture reaches the level of 0.55, an undesirable light polarization starting. Light polarization reduces light efficiency by degrading imaging contrast.
To avoid this ASML probably polarizers will use. However, adding them will block the light, reduce power efficiency, and therefore increase production costs. This problem has to be solved.
Hyper-NA’in Another challenge is resistance will be. This will make it harder to maintain resolution and will likely require further thinning of the resist materials. Of course, the problems are not at a level that ASML engineering cannot solve. Therefore, with the physical limits of High-NA being reached, Hyper-NA towards the end of this decade It will probably become widespread throughout the industry.
The industry’s first High-NA lithography system was established by Intel, which did not adopt 0.33 NA EUV tools due to difficulties in multiple patterning, and handed over its semiconductor manufacturing leadership to TSMC during this time. IntelWith High-NA, it aims to take the process leadership from TSMC in the next few years. Frankly, Intel did not want the cost burden with multiple patterning. You can think of it in its simplest form as follows: You have two very small masks in your hand. You need to put them on top of each other without any margin of error. Intel waited for High-NA instead of this challenge. Intel did not specialize in dual patterning as much as TSMC.
TSMCat least for now Does not plan to install High-NA tools. Samsung, Micron ve SK Hynix Chip manufacturers such as are also waiting in line for High-NA.
Thanks to High-NA, 2 nm’den 14 angstrom’a, 10 angstrom’a (1nm) has a width of 7 angstrom’a We will see process technologies ranging from After this, Hyper-NA will come into play.
Outside of lithography, researchers are trying to reduce the size of transistors to maintain scalability, but there is a limit to this. Producing 2 angstrom devices means there are two atoms in the middle. This means that at some point development will become impossible or too costly. Therefore in the future Materials to replace silicone will be. There are materials that can replace silicon (see graphene) and provide electrons with higher mobility.
Researchers are not actually looking for a material that will replace silicon overnight. We’ll likely see chips based on silicon but also containing a layer of graphene or another material in the next few decades.
Source
https://www.techpowerup.com/323561/asml-unveils-plans-for-next-generation-hyper-na-extreme-ultraviolet-lithography
https://www.tweaktown.com/news/98798/asml-expects-it-will-offer-hyper-na-chipmaking-machines-by-2030-reaching-just-0-75/index.html
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