Honor has launched its first foldable flip-style phone, the Honor Magic V Flip, in China. While introducing this new model of the company, Honor CEO Zhao Ming also made some statements about the previous Honor Magic V2 and gave hints about the upcoming Magic V3.
In a meeting held after the launch of Magic V Flip, Ming stated that Honor Magic V3 is in intensive development. Ming emphasized that Magic V3 will be an impressive and pioneering foldable phone. Expressing Honor’s commitment to innovation, Ming stated that although 11 months and 20 days have passed since the 9.9mm thickness test, Magic V2 is still the thinnest foldable phone on the market. He reiterated Honor’s commitment to breaking its own records, saying it was one of the company’s core values.
As you may remember, Honor Magic V2 was announced in July 2023. This model earned the title of the world’s thinnest foldable phone, with a thickness of only 4.7mm when opened and 9.9mm when closed. Magic V2, which is thinner than many traditional flat-screen phones with its slim design, is considered an important milestone in foldable phone design.
Unfortunately, there is not much information about the specifications of the Honor Magic V3. However, some speculations suggest that the Magic V3 will feature the Snapdragon 8 Gen 3 chipset. Leaks that appeared a few weeks ago show that the battery capacity of the phone may exceed 5,000mAh and that it will have a fingerprint scanner located on the side. Currently, Vivo X Fold 3 Pro, which has a 5,700mAh battery, is known as the model with the largest battery among foldable phones. Although it carries a large battery, this model has a thickness of 5.2mm when opened and 11.2mm when closed. Magic V3 is expected to be launched in China in July.
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