Japan’s semiconductor breakthrough begins
At the end of last year, Rapidus started to establish the latest semiconductor production equipment in the Innovative Integration for Manufacturing (IIM) facility in the Chitose region of Hokkaido. Among these equipment ASML ‘advanced level EUV ve Where There are also lithography systems. It is estimated that the company has reached the ‘first light’ stage in Wafer production with these advanced vehicles. This is Rapidus Gate-All-Around (GAA) means that it can begin to produce its own circuits with the 2NM production process based on transistor architecture.
The biggest advantage of giants such as TSMC, Samsung Foundry and Intel Foundry is Rapidus’s full advantage Automatic Advanced Packaging aims to realize their processes in the same production facility. This approach can significantly shorten the production time of designs that need advanced packaging. However, for now, the company will only focus on the production of WAFER and will not offer test packaging service.
Rapidus sets up a new R & D center called Rapidus Chiplet Solutions (RCS) at Seiko Epson’s Chitose to improve production processes. RCS, which has been preparing for October 2024, will begin the installation of production equipment as of this month. This facility focuses on the development of scaled production techniques, and will carry out studies at critical stages such as redisting layer (RDL) interposer structures, three -dimensional packaging methods, complex assembly design kits (ADK) and KGD (robust chip) test processes.
Rapidus CEO Atsuyoshi Koike said that production facilities are progressing as planned and the pilot production line will be commissioned at the end of this financial year. Firm, 2027 In the 2nm process until the year to mass production It also aims to pass. This goal is falling into a similar period with its competitors.
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Source link: https://www.donanimhaber.com/japon-rapidus-2nm-surecinde-deneme-uretime-basliyor–189711