The triple alliance of SK hynix, TSMC and NVIDIA will announce a joint plan at the SEMICON event. This plan is thought to be related to next-generation technologies such as HBM4, which will expand the AI markets. SEMICON is one of the most important organizations of the semiconductor industry. At this event, major companies, SK hynix and TSMC, will announce their plans for the future.
SK hynix and TSMC to collaborate on HBM4 memory, NVIDIA to create designs
This year’s event becomes more important than ever with the participation of NVIDIA CEO Jensen Huang, SK hynix President Kim Joo-sun and senior executives. The main focus this year will be on the next generation of HBM, specifically the revolutionary HBM4 memory.
The launch of HBM4 memory could be a big step for the AI segment. Companies started to take steps to change their strategies. SK hynix announced that it plans to integrate memory and logic semiconductors in a single package. Thus, it will be at the highest level in the desired performance.
To achieve the goal, giant companies plan to establish a strategic “triple alliance” with the product design of SK hynix, TSMC and NVIDIA. Although it is not certain at the moment how SK hynix will implement HBM4 memory, TSMC and NVIDIA’s cooperation with the Korean giant shows that there is a solution in this regard.
The SEMICON event will determine how AI accelerators will use this memory standard in the future. The SK hynix TSMC and NVIDIA alliance shows us that companies are ready to evaluate the markets and leave no room for growth or exposure to competitors. There is a lot of news circulating about the mass production schedule of HBM4. The triple alliance is expected to have these products ready by 2026.
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