Samsung introduced 36 GB HBM3E 12H memory
For those who don’t know, HBM memories consist of multiple DRAM modules stacked vertically, each called a stack or layer. Samsung’s new HBM3E 12H In the module, each DRAM module has a capacity of 24 gigabits (Gb), equivalent to 3 gigabytes (GB), and there are twelve of them. Thus, the total capacity becomes 36 GB.
According to Samsung, to ensure that the 12-stack HBM3E has the same height as the 8-stack ones to meet the package requirements TC NCF (thermal compression non-conductive film) technique was applied. It is stated that in this way, the gap between the stacks is reduced to only micrometers. According to Samsung, the 12-stack HBM3E improves vertically compared to the 8-stack HBM3. more than 20 percent intense has been ensured.
On the performance side, for HBM3E 12H, Samsung states that the average speed of artificial intelligence training has increased by 34 percent and the number of concurrent users of inference services has increased 11.5 times compared to HBM3 8H. Samsung already offers its customers HBM3E 12H samples has started to provide and this mass production in the second half of the year is intended to be passed. Thanks to HBM3E 12H memories, Samsung has strengthened its hand against SK Hynix and Micron. These memories will be used especially in artificial intelligence GPUs.
Source
https://www.sammobile.com/news/samsung-launches-36gb-hbm3e-12h-dram/
https://news.samsung.com/global/samsung-develops-industry-first-36gb-hbm3e-12h-dram
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