Glass revolution in semiconductors is near
The issue of glass substrate was on our agenda last year. However, our actor at that time was Intel, not Samsung. Intel, glass substrate first in packaging facility demo samples It aims to offer complete glass substrate solutions from the second half of this decade and deliver 1 trillion transistors on a package by 2030. However, Samsung wants to leave Intel behind with its 2026 targets.
Samsung Electro-Mechanicsis accelerating its initiatives in the semiconductor glass substrate market in its equipment supply and installation activities. The company launched a new generation package for its new generation packaging in the fourth quarter. pilot production line plans to open. On the other hand, Samsung has also selected its suppliers for the projects it will develop. According to reports, Samsung, in 2026 wants to move into glass substrate production for high-end systems-in-package (SiP).
Glass substrates offer significant advantages over traditional organic substrates, including ultra-flatness that improves lithography focus and excellent dimensional stability for interconnects. Compared to modern organic substrates, glass with better thermal, physical and optical properties together Up to 10x more interconnects can increase density. Also the depth of focus 50 percent less pattern distortion that increases may allow. These steps taken by Samsung Electro-Mechanics will of course be very valuable for Samsung Foundry in the future.
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