It will be much more efficient with new production and packaging technology
TSMC’nin second generation 3nm The chipset, which will be produced with the process, will be produced using TSMC’s advanced production process. InFO-POP It will have much higher power efficiency with packaging technology.
Apple’s A17 Pro InFO-POP (fanout package-on-package) packaging technology, which is also used in the chipset, It reduces the footprint and height of the chipset. Decreasing volume, while increasing thermal efficiency, It will also allow more space to be opened for other components.
Design work has been completed mentioned Tensor G5 on 3nm process It has reached the exit level from the band. Chipset like Apple and Qualcomm a special CPU and GPU design is expected to have. Thanks to the custom design, Google will have more control over software and hardware integration. In terms of performance, we are looking forward to seeing how the new processor will compete with its competitors.
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Source link: https://www.donanimhaber.com/tensor-g5-gelismis-uretim-ve-paketleme-teknolojisiyle-geliyor–180756