TSMC has started a new era in the chip wars, they will be seriously unrivaled.

TSMChas started using the latest SoIC packaging technology for four major customers such as AMD, Nvidia, Broadcom and Apple. This new technology enables high-density 3D chip stacking by enabling heterogeneous integration of chips of different sizes. This method, first introduced in 2018, uses wafer-on-chip packaging technology. The company has two advanced packaging facilities planned in Chiayi, Taiwan. CoWoS (Chip on Wafer on Substrate) facility and a SoIC facility.

Especially AppleBy combining this technology with hybrid molding, a new generation of artificial intelligence-supported
Apple Plans to use it for Silicon or M4 chip. Apple is reportedly testing this new packaging solution in a small-scale trial production and aims to go into mass production in 2025. It is also on the agenda that there will be a switch to 2nm processor node for the M4 chip, which is expected to be released with the new generation MacBook Pro.

TSMC has started a new era in the chip wars, they will be seriously unrivaled.

AMD became the first customer to adopt TSMC’s SoIC technology by using this technology in the Instinct MI300 AI accelerator chips designed for data centers. apple,
AMD, Companies such as Nvidia and Broadcom aim to increase the performance of their hardware by using TSMC’s SoIC and CoWoS technologies in their own products.

AppleConsidering that among ‘s new generation chips, M1 was launched in November 2020, M2 in June 2022, and M3 in October last year, the M4 chip is expected to be available in the first half of next year. With these innovations, Apple and other major technology companies will continue to constantly improve their hardware technologies and provide the highest level of performance.