TSMC is at the door of ASML
Although TSMC thought it could get by without High-NA EUV lithography machines and that these tools would not make economic sense before 2026, things seem to have changed. For TSMC CEO’su C.C. Wei’It is reported that he quietly visited ASML’s headquarters. Moreover, this visit took place during the company’s symposium in Taiwan.
ASML could not officially disclose its CEO’s trip, but it was confirmed by ASML CEO Christopher Fuke and TRUMPF CEO Nicola Leibinger-Kammüller and their respective social media accounts. ASML CEO said in his statement that they introduced their latest technologies and new products, especially the new High-NA EUV, to Wei.
On the other hand, TSMC’s arch-rival in the past and probably in the future, if not now Intel, is the strongest company on High-NA EUV. Intel had already received and installed the first machine, worth $400 million. Latest reports are that the processor giant, ASML Purchased 1 year’s production capacity says. This means approximately 5-7 devices. Apart from Intel, Samsung and SK Hynix are expected to start receiving these machines in the second half of next year.
For those who don’t know, High-NA EUV lithography machines can increase chip density by 2.9 times by producing 1.7 times smaller transistors compared to existing EUV machines. ASML’s Twinscan EXE High-NA EUV lithography machines are vital for producing next-generation process technologies smaller than 2nm.
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