TSMC will establish 7 new production facilities in 2024

TSMC expands its global footprint

Manager of the FAB18 factory in Tainan, one of Taiwan’s special cities Huang Yuan-kuo According to the statements made by TSMC, TSMC will establish three wafer facilities and two packaging facilities in Taiwan, as well as two wafer facilities abroad. All facilities will be built to meet the rapidly growing global demand for high-performance computing devices and smartphones.

As for the facilities to be established, there are two new wafer (chip plate) facilities under construction in Taiwan since 2022. 2nm Chips shaped by this process will be produced. Mass production in both facilities Starting in 2025 is planned. Meanwhile, the construction of an advanced packaging factory in the country started last year. The construction of the other packaging facility will start this year. This facility will be completed in 2026 CoWoS ve SoIC will realize mass production of its technologies. Both of these packaging technologies are very valuable for new generation and existing artificial intelligence hardware.




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