Samsung, the world’s largest memory chip manufacturer, held a meeting in the USA SFF 2024announced the latest chip packaging technology and service roadmaps. Thus, Samsung HBM for chips 3D packaging technology announced it for the first time at a public event. This is important because currently HBM chips are mostly packaged with 2.5D technology.
HBM4 is likely Nvidia’s new product, expected to be released in 2026 R100 Rubin GPU will be placed in the model. Nvidia announced Rubin about two weeks ago during Computex in Taiwan. rubin, TSMC’newer of N3 knot and new CoWoS-L It will enter mass production in the 4th quarter of 2025, using its advanced packaging. Rubin R100 AI GPUs will be released in 2026. Therefore, for HBM4 that will be included in these GPUs Samsung, Micron and SK Hynix are in a big race in.
Samsung is betting big for HBM4
Samsung’s latest packaging technology features HBM chips stacked vertically on top of a GPU to further accelerate data learning and inference processing, seen as a game-changer in the rapidly growing AI chip market. Currently, HBM chips are horizontally coupled with the GPU on a silicon interposer under 2.5D packaging technology.
According to Samsung, 3D packaging greducing consumption and processing delays It will improve the quality of electrical signals of semiconductor chips. Meanwhile, in 2027, Samsung plans to introduce its all-in-one heterogeneous integration technology, which incorporates optical elements into a single unified AI accelerator package that significantly increases the data transfer rate of semiconductors.
According to market analysts, HBM is expected to account for 21 percent of the DRAM market in 2024 and 30 percent in 2025. The advanced packaging market, including 3D packaging, is expected to reach $80 billion by 2032, a 150 percent increase compared to now.
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